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World Congress on Mass Customization to Take Place in Hong Kong

2005-05-03 - Hong Kong: The 2005 Interdisciplinary Congress on Mass Customization and Personalization will take place on 18-21 September 2005 at the Hong Kong University of Science and Technology. The MCPC congress is the original and largest international scholarly meeting to address the multidisciplinary aspects of Mass Customization and Personalization (MCP).

Following the example of the first two events which were held with large success in Hong Kong (2001) and Munich (2003), the 2005 meeting promises again to contribute to the development of technologies and management principles for MCP.

With a high attendance of managers of mass customization companies, the last two congresses were also an excellent opportunity to bridge between research and practice.

When Mass Customization and Personalization (MCP) emerged in the literature and notion of managers, these concepts were placed as an explicit antagonism to mass production. However, learning from experiences of successful MCP companies, it seems that these two styles of manufacturing can be synergistic. Therefore, the 2005 Conference theme is 'Converging Mass Customization & Mass Production'. The Call For Conference Papers is shown below.

In addition to the Hong Kong-based conference, there is also the 'MCP China Seminar'. This is aimed at those who are interested in exploring the development of Mass Customization and Personalization in China. This special seminar on 'MCP in China' will be arranged and take place in Hangzhou directly after the MCPC2005.

Call for Papers (Abstracts)
We call for extended abstracts in one of the following topics of interest (including but not limited to):

A) Competitive Advantage Through Customization and Business Strategy
B) Customer Centric Enterprises
C) MCP Design & Innovation
D) MCP Manufacturing Planning and Technologies
E) MCP Information Systems, Configuration and Customer Interaction Technology for MCP
F) MCP and Supply Chain Management
G) MCP Best Practices and Case Studies
H) Beyond MCP: Open Innovation and Customer Integration

The MCPC 2005 submission system has been changed to an innovative rolling process with several possibilities to submit abstracts with proposals for presentations. The earlier you submit an abstract (1000 words), the earlier you will know if your proposal is accepted. All three rounds, however, provide equal opportunities of acceptance and placement in the program.
Submit your abstract for the third round of the submission process:

Abstract submissions are due on May 30, authors will get notification on June 15.
Final manuscripts (full papers) must be received by July 1, 2005. Submitted abstracts will be subject to a double-blind review process by an international program committee and adjudication by the program chairs.

For more information on how to format and submit an abstract, check the conference web site:

http://www.mcpc2005.com

Conference Co-Chairs

Mitchell M. Tseng

Director, Advanced Manufacturing Institute
The Hong Kong University of Science & Technology (HKUST), Clear Water Bay, Kowloon, Hong Kong
mcpc2005@ust.hk

Frank T. Piller
MIT Sloan School of Management & TUM Business School,
E52-513, Cambridge, MA 02139, USA
piller@mit.edu

The conference is organized by The International Institute of Mass Customization and Personalization (IIMCP), an academic society to foster research and exchange on mass customization and personalization (http://www.mcp-institute.org).

Selected papers of the conference will be included in a special issue of 'The International Journal on Mass Customization' (www.digiprise.org/jmc/) and an edited book in the series 'Advances in Mass Customization' (Springer).



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